brittle deformation

The brittle deformation is a very important mechanism during the thrust formed.

宏观构造、显微构造特征反映出该断裂带为一条脆性逆冲推覆断裂，其变形机制主要为碎裂作用。

A better transition layer material was confirmed,which overcame the problem of fragmentation and lamination of PDC.

确定了一种效果较好的过渡层,较好地解决了金刚石/硬质合金复合片碎裂及分层的问题。

The fragmentation influences the char combustion behavior in a fluidized bed combustor.

利用下行气流振动床代替流化床 ,研究了煤的碎裂特性 。

Based on the perturbative QCD predictions of gluonic distributions and branch cross section of the J/(?) decay via hadronic, electromagnetic,and radiative channels, the strict solutions of LUND area law of string fragmentation had-ronization are used to treat nonperturbative hadronic production processes, a possible description and Monte Carlo packet for the J/(?) hadronic decay are obtained.

基于微扰QCD所预言的J/ψ衰变道胶子分布及其分支截面和LUND弦碎裂模型强子化面积定律的严格解,得到J/ψ所有衰变模式的微扰和非微扰过程的一种可能的描述,相应的Monte Carlo产生器LUARLW所作的初步模拟结果与BES获取的J/ψ数据的多种带电粒子谱分布和事例形状拓扑分布符合较好。

An Analysis on Break of Separating Ring for Horizontal Concasting and Improved Measures;

水平连铸分离环碎裂的分析和改进措施

The results show that the fracture process of weathering is a fractal one.

因此,分形维至少有2个数值,一为结晶颗粒粒度分形维,一为碎裂颗粒粒度分形维。

Failures of IC smart cards,caused by fracture of thin/ultra-thin Si chip,break of wire bonding or ESD etc.

分析研究了IC智能卡芯片碎裂、引线键合断裂、静电放电损伤等失效模式和失效机理,并结合IC卡制造工艺和失效IC卡的分析实例,对引起这些失效的根本原因作了深入探讨,就提升制造成品率、改善可靠性提出应对措施。

The fracture of thin/ultra-thin silicon dies accounts for half of the failures of IC cards,and its failure modes and failure mechanism are not well understood then.

薄/超薄芯片的碎裂占据IC卡早期失效的一半以上,其失效模式、失效机理亟待深入研究。

Based on the results of underground observations and model tests of simulated materials of immediate roof, it is expounded that fragmented roof belongs in cataclastic rock mass,and its caving characteristics is clarified in this paper too.

本文根据直接顶岩体冒顶现场实测和相似模拟实验结果，阐明综采面破碎顶板的碎裂岩体属性与冒顶特征，并建立碎裂岩体冒顶力学模型，深入研究冒顶本质原因和控制原理。