differential unit

This article introduces the application of microwave modules and the importance of its assembling welding.

介绍微波组件的应用及其组装焊接的重要性,提出组装焊接中焊点的特点,并对焊点失效进行详细机理分析,阐述机械应力和热应力对焊点失效的影响,在焊接工艺和焊点设计方面找到抗失效断裂的有效措施,从而保证焊点的质量,提高微波组件的可靠性。

For air-borne,satellite-borne and ship-borne phased array radars,the microwave modules with small size,lightweight,high performance and high reliability are needed because of their special environment.

机载、星载、舰载相控阵雷达由于其特定的使用环境,需要体积小、重量轻、高性能、高可靠、低成本的微波组件,带腔体LTCC基板具有高密度布线、电阻、电容、电感的内埋以及芯片的埋置等特性,是制作机载、星载、舰载相控阵雷达微波组件的理想的高密度基板。

Microwave volume packaging technologies are effective methods for realizing microwave modules miniaturization and weight reduction with high density and good performance.

微波立体组装工艺是实现微波组件小型化、轻量化、高组装密度和优良电气性能的有效途径。

Low temperature co-fired ceramics(LTCC) technology and three dimensional(3D) microwave cubic packaging technology for microwave modules are effective methods for realizing microwave modules miniature and light with high performance and high reliability.

低温共烧陶瓷(LTCC)技术和三维立体组装技术是实现微波组件小型化、轻量化、高性能和高可靠的有效手段。

This article introduces the microwave module, their place and application in the phased array radar.

介绍了用于相控阵雷达的微波组件 ,论述微波组件在相控阵雷达中的地位及应用 ,阐述了微波组件制造技术的重要性。

Low temperature co fired ceramic s (LTCC) and flip chip (FC) are excellent packaging and interconnection technologi es for realizing miniature and high reliable microwave modules.

低温共烧陶瓷 (LTCC)和倒装芯片 (FC)是实现小型化、高可靠微波组件的一种理想的组装和互连技术。

Design of Certain Kind of Microwave Subassembly Testing Equipment Based on Virtual Instrument Technology;

基于虚拟仪器的微波组件测试系统设计

Thermal Design for a Satellite-borne Microwave Equipment

应用于真空环境中的某微波组件热设计的研究

Thermal Analysis of Beam Lead PIN Diode for Microwave Modules

微波组件用pin梁式引线管热元模型分析研究

Analysis of the Interconnect in Microwave Multi-chip Module by Parallel FDTD Technique;

并行FDTD技术分析微波多芯片组件的互连效应

Performance of a silicon-based embedded MMCM package

一种硅埋置型微波多芯片组件封装的电性能

microelectronic modular assembly

微电子学微型组件装置

Analysis and Research on Microwave Solid-state Power Amplifying Module and Influenses of Its Magnitude and Phase Characteristics;

微波固态功放组件及其幅相特性影响分析和研究

A Kind of High Power Millimeter Microwave Device-Relativistic Backward-Wave Oscillators

一种高功率微波器件——相对论返波管

binary logic module

二进制逻辑微型组件

sound surface wave multichannel filter assembly

声表面波多通道滤波器组件

MADDAM (Micromodule and Digital Differential Analyzer Machine)

微型组件及数字微分分析机

An electric circuit consisting of miniaturized components.

微型电路由微小部件组成的电路

SYNTHESIS OF PHOTORESPONSIVE AZO-ACCEPTOR VIA SOLVENT-FREE REACTION USING MICROWAVE AND LIGHT WAVE;

微波光波组合干法促进光敏性偶氮受体的合成

Research on Difference Validity of Integrated Long-wave/Microwave Navigation System

长波/微波组合导航系统差分有效性研究

Problems and Development of Finite Element Method for Microwave and Optical Devices

有限元法应用于微波和光波器件的问题和发展

Research of Photonic Crystals and Its Application on Microwave Filter;

光子晶体及其在微波滤波器件中的应用研究

Magnetotunable microwave transmission properties of a magnetoinductive device

频率可调磁感应波器件的微波透射性能

modular data inputoutput system

微型组件组成的数据输入-输出系统