ceramic package

Using Ni-Co alloy to substitute Ni as the sublayer of gold plating for ceramic package is an important way to improve its resistance to high-temperature.

为了使用Ni Co合金代替Ni作为陶瓷封装电镀金层的底镀层以提高它的抗高温老化能力 ,系统地研究了从氨基磺酸盐镀液中获得低Co含量Ni Co合金镀层的规律 。

Surface analysis of cavity for ceramic packages from main process steps is carriedout with SEM and EDX.

采用SEM和EDX对主要的陶瓷封装外壳生产工艺阶段的芯腔表面进行了形貌观察和成分分析。

The temperatures on the cover edges near the solder-loop and at the bottom of the ceramic package were about 320 ℃ and 100 ℃,respectively.

采用红外热像仪、氦质谱检测仪、六轴测试仪和三维显微镜,分别对陶瓷封装过程中的局部温度变化、温度分布、气密性、封装强度和封装断面进行了检测和分析。

these inks contain major components of the colour for ceramic decoration in the form of a colloidal aqueous sol which dries to a gel after printing on the ceramic and then converted to the coloured decoration on firing.

这些彩色墨水含有陶瓷装饰的主要成分 ,并且以水溶胶的形式存在。

This paper explores the application of black and white color scheme in ceramic decoration from the development of black and white enamels, the visual effects of black and white contrast, bla.

本文正是从黑白釉装饰的发展历程,黑白对比的视觉效果,黑白的空间、光影效果等方面探求了黑白艺术在陶瓷装饰中的运用。

Special Photoshop effects can give artists inspirations for the design of ceramic decoration.

借鉴Photoshop中的特殊效果可以启发艺术家的陶瓷装饰设计思维,通过色彩和图形两个方面论证了Photoshop中的特殊效果对陶瓷装饰设计的引导,认为利用计算机的随机性和特殊性可以革新艺术家的传统的陶瓷装饰设计。

DOP experimental study on EFP penetrating Al_(2)O_(3) armor ceramic;

爆炸成型弹丸对Al_2O_3装甲陶瓷材料的侵彻实验研究

Reducing the stress act on LiNbO_3 chip adopting fall temperature grads and intermingle crystal SiO_2 in epoxy resin,solved the difficulty of LiNbO_3 chip s crazing,LiNbO_3 SAW SMD full ceramic packaging has came true.

文章对铌酸锂声表面波SMD的全陶瓷封装中存在的技术难点及解决方法进行了浅析。

This article tries to analyze their difference of art characteristic by the shape of ceramic、the color of glaze and the decoration of ceramic.

本文试从唐宋陶瓷造型、釉色和陶瓷装饰等方面浅析其艺术特点上的差异。

The generator represents magnetron, packaged with constant magnets in ceramic-metal execution.

该磁控管采用金属陶瓷封装，装有永磁体。

Impact of Hot-Cutting Defect on Reliability of Ceramic Packaging and a Novel Concept of Structure Design;

热切缺陷对陶瓷封装可靠性的影响和一种结构设计新概念

An Expression for the Property Degradation of the Ceramic Encapsulation Capacitor under Thermal Cycling and Co-60γ Radiation;

热循环及Co-60γ辐照环境下陶瓷封装电容器的性能退化

ceramic dual in-line package

陶瓷双列直插式封装

Study on Antibullet Performance of Metal-ceramic Composite Armor

金属封装陶瓷复合装甲抗弹性能研究

Packages canbe plastic, ceramic, Cer-DIP, or other type.

封装类型可以是塑料型、陶瓷型、陶瓷双列直插型或其它类型。

Study of the Process of the Flip Chip Package Based on Aluminum Nitride Substrate

以氮化铝陶瓷为基板的倒装式封装工艺研究

The generator represents magnetron, packaged with constants and electromagnets(2 coils magnetic) in the magnetic-shielded ceramic-metal execution.

该磁控管的设计采用电磁石，封装采用金属陶瓷。

paste-on-paste pate-surpate

(陶瓷装饰) (法) 堆花

gable-end ornament, ceramic

山墙部装饰物,陶瓷的

which is in a ceramic teapot.

这些茶装在陶瓷茶壶中。

ON CERAMIC SCULPTURE AND INSTALLATION OF ENVIRONMENTAL CERAMIC ART

论环境陶艺中的陶瓷雕塑与装置艺术

The Second Metallizing Process of Ceramic to Metal Seal

陶瓷-金属封接中的二次金属化工艺

Active Alloy Brazing Al_2O_3 Ceraics and Metal;

氧化铝陶瓷与金属活性封接技术研究

The Study of SiO_2-Al_2O_3 Sol Sealing Reagent for Ceramic Coatings

陶瓷涂层SiO_2-Al_2O_3溶胶封孔剂的制备研究

Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-Ti

Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金

Comparison of residual stress formed in tubular ceramics/metal jointing process

管状陶瓷金属封接残余应力计算比较

Seal Structure and Technique of Broad Band High Power Rectangular Ceramic Hermetic Windows

宽带高功率矩形陶瓷密封窗封接结构及工艺