starting borer

The probability distribution models of fire load density,ventilation factor and thermal absorptivity of wall were established.

通过总结各国在全盛期室内火灾升温的参数化模型研究领域的成果和统计国外火灾荷载调查数据,分析了模型输入参数的随机性,建立了火灾荷载密度、开口因子和房间壁面热惰性的概率分布模型,并给出了不同用途房间的火灾荷载密度均值和变异系数、开口因子模型参数的概率密度函数及不同房间壁面热惰性的范围。

bit cutting angle

钻冠的尖度，钻头磨角，钎子头刃角

A Study of New Flux for Sn-9Zn Lead-free Electronic Solders;

Sn-9Zn无铅电子钎料新型助焊剂研究

Research on A Series of V-B Solder Used in Vacuum Electronic Devices

真空电子器件用V-B系列钎料研究

Research development of high temperature lead-free solders for electronic assembly

电子组装用高温无铅钎料的研究进展

The Technology of Resistance Brazing for Head Menging Sheathes of Inserting Copper Bar Rotors

插入式铜条转子并头套电阻硬钎焊工艺

Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;

电子封装互连无铅钎料及其界面问题研究

The Research of Brazing Application for Measuring Installation of Fast Neutron Experimentation Reactor;

快中子实验反应堆测控装置钎焊技术研究

The Development of the Real-time Measurement System of the Temperature Field of the Electron Beam Jointing;

电子束钎焊温度场实时检测系统的研制

Study on the Lead-Free Solder Paste Prepared by Mechanical Alloying in SMT;

电子组装膏状钎料机械合金化制备及研究

Research on PdNb Alloy Brazing Material Used for Cathode Welding of Vacuum Electron Devices

真空电子器件阴极焊接用PdNb合金钎焊料的研制

Research Progress of Au-and Ag-based Mid-temperature Brazing Filler Alloys for Electronic Industry

电子工业用金基和银基中温钎料的研究进展

FINITE ELEMENT IMPLEMENTATION TO TIME-DEPENDENT CONSTITUTIVE MODEL OF SOLDER IN MICRO-ELECTRONIC PACKAGING

微电子封装钎料时相关本构模型的有限元实现

Making an Investigation in the Technological Method of the Medium-frequency Induction Braze Welding of the Rotor Copper Bar and Endˉring for the AC and DC Motor

交直流电机转子铜条与端环中频感应钎焊工艺方法的研究

DETERMINATION OF Ag,Cu,Zn and Cd IN SILVER BRAZING FILLER METALS BY ICP AES

电感耦合等离子体发射光谱法测定银基钎料中银、铜、锌和镉的含量

Numerical Simulation of Temperature Field and Stress Field of Electron Beam Brazing Two Kinds of Radiator;

两种散热器电子束钎焊温度场和应力场数值模拟

Time-Dependent Damage Coupled Constitutive Model of Solder Alloy in Micro-Electronic Packaging at High Tempertaure and It's Application;

微电子封装钎料高温时相关耦合损伤本构模型及其工程应用

Basic Technology of Repairment and Numerical Simulation on Electron Beam Brazing of Engine Vanes;

发动机叶片电子束钎焊修复工艺基础及数值模拟

Damage-coupled Multiaxial Time-dependent Low Cycle Fatigue Failure for Electronic Packaging Solder Alloy

电子封装钎料合金耦合损伤的多轴时相关低周疲劳失效研究